The new design is applied to the inspection and analysis of foreign objects on the wafer surface, high-speed detection, high resolution, high CP value wafer defect inspection machine.
Equipped with AI function learning function, it will approximate the shape, size, light and dark of particles, etc., and simulate the human visual classification method to make a classification of intelligent defect inspection system.

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【 feature of product 】

* High-speed defect detection: 6 "wafer can be tested in 10 minutes, resolution 0.69um (other specifications optional)

* High versatility: Defects are transferred to wafer map display, and image processing parameters are marked

* Automatic alignment: Built-in X Y θ three-axis relative positioning system

* Customized: Designed according to the actual needs of the samples, such as: wafer size, detection image magnification

* Expansibility: expand Cassette or Robot Load / Unload

* AI learning defect classification judgment

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